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Mechanical, microstructural and electrical evolution of commercially pure copper processed by equal channel angular extrusion

Autor
Higuera, O.; Cabrera, J.
Tipus d'activitat
Article en revista
Revista
Materials science and engineering A. Structural materials properties microstructure and processing
Data de publicació
2013-06-01
Volum
571
Pàgina inicial
103
Pàgina final
114
DOI
https://doi.org/10.1016/j.msea.2013.01.076 Obrir en finestra nova
Projecte finançador
AUMENTO DE LA DUCTIBILIDAD EN FRIO DE MATERIALES METÁLICOS CON TAMAÑO DE GRANO NANOCRISTALINO Y ULTRAFINO
Repositori
http://hdl.handle.net/2117/19921 Obrir en finestra nova
Resum
Samples of commercially pure copper (ETP copper) were subjected to equal-channel angular pressing (ECAP) for up to 16 passes at room temperature following route Bc. Microstructural evolution was determined by oriented image microscopy (OIM) and differential scanning calorimetry (DSC) was used to estimate the stored deformation energy and the recrystallization temperature after each ECAP pass. On the other hand, electrical properties were correlated with the associated energy that results from th...
Citació
Higuera, O.; Cabrera, J. Mechanical, microstructural and electrical evolution of commercially pure copper processed by equal channel angular extrusion. "Materials science and engineering A. Structural materials properties microstructure and processing", 01 Juny 2013, vol. 571, p. 103-114.
Paraules clau
Copper, Differential Scanning Calorimetry (dsc), Electrical Conductivity, Electron Backscattered Diffraction (ebsd), Equal Channel Angular Pressing (ecap)
Grup de recerca
PROCOMAME - Processos de Conformació de Materials Metàl·lics

Participants