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Microstructure influencing physical and mechanical properties of electrolytic tough pitch copper produced by equal channel angular pressing

Autor
Higuera, O.; Cabrera, J.
Tipus d'activitat
Article en revista
Revista
Mechanics of materials
Data de publicació
2013-11
Volum
67
Pàgina inicial
9
Pàgina final
14
Repositori
http://hdl.handle.net/2117/22410 Obrir en finestra nova
Resum
Samples of electrolytic tough pitch (ETP) copper were subjected to equal-channel angular pressing (ECAP) for up to 16 passes at room temperature following route Bc. The microstructural evolution was followed by Oriented Image Microscopy (OIM) and Differential Scanning Calorimetry (DSC) was used to estimate the activation energy and the recrystallization temperature after each ECAP pass. Also, mechanical properties after each pass were evaluated by tensile tests. Finally, electrical properties we...
Citació
Higuera, O.; Cabrera, J. Microstructure influencing physical and mechanical properties of electrolytic tough pitch copper produced by equal channel angular pressing. "Mechanics of materials", Novembre 2013, vol. 67, p. 9-14.
Paraules clau
EBSD, ECAP, ETP copper, Electrical conductivity, Mechanical properties, SPD
Grup de recerca
PROCOMAME - Processos de Conformació de Materials Metàl·lics

Participants