Carregant...
Carregant...

Vés al contingut (premeu Retorn)

Characterization and modeling of the conducted emission of integrated circuits up to 3 GHz

Autor
Berbel, N.; Fernandez-Garcia, R.; Gil, I.
Tipus d'activitat
Article en revista
Revista
IEEE transactions on electromagnetic compatibility
Data de publicació
2014-08-01
Volum
56
Número
4
Pàgina inicial
878
Pàgina final
884
DOI
https://doi.org/10.1109/TEMC.2013.2294256 Obrir en finestra nova
Projecte finançador
CARACTERIZACION Y MODELADO DE LA FIABILIDAD Y ROBUSTEZ DE INTERFERENCIAS ELECTROMAGNTICAS RADIOFRECUENCIA CIRCUITOS INTEGRADOS
Repositori
http://hdl.handle.net/2117/24147 Obrir en finestra nova
Resum
In this paper, an electrical model in order to predict the electromagnetic compatibility (EMC) conducted emission of integrated circuits (ICs) up to 3 GHz is presented. The electrical model predicts the behavior of the propagation paths of electromagnetic conducted emissions at high frequency by including all distributed effects and capacitive and inductive couplings. The proposed model has been compared with the standard IC emission model (ICEM-CE) to predict the EMC of a clock generator by mea...
Citació
Berbel, N.; Fernandez-Garcia, R.; Gil, I. Characterization and modeling of the conducted emission of integrated circuits up to 3 GHz. "IEEE transactions on electromagnetic compatibility", 01 Agost 2014, vol. 56, núm. 4, p. 878-884.
Paraules clau
Conducted emissions, IC emission model (ICEM-CE), computational electromagnetics CEM, electromagnetic compatibility (EMC), feature selective validation (FSV), integrated circuit (IC), internal activity (IA), selective validation FSV
Grup de recerca
PERC-UPC - Centre de Recerca d'Electrònica de Potència UPC
RFEMC - Grup de Radiofreqüència i Compatibilitat Electromagnètica en Xarxes de Comunicacions
TIEG - Terrassa Industrial Electronics Group

Participants