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Modeling technique of the conducted emission of integrated circuit under different temperatures

Autor
Berbel, N.; Fernandez-Garcia, R.; Gil, I.
Tipus d'activitat
Article en revista
Revista
International journal of numerical modeling. Electronic networks devices and fields
Data de publicació
2016-03-01
Volum
29
Pàgina inicial
291
Pàgina final
300
DOI
https://doi.org/10.1002/jnm.2076 Obrir en finestra nova
Projecte finançador
Nuevas estratégias de diseño electrónico para el despliegue de redes de sensores inalambricas de bajo coste en tejidos inteligentes
Repositori
http://hdl.handle.net/2117/28179 Obrir en finestra nova
URL
http://onlinelibrary.wiley.com/doi/10.1002/jnm.2076/abstract Obrir en finestra nova
Resum
Copyright © 2015 John Wiley & Sons, Ltd. In this paper the temperature impact on conducted emissions of ICs up to 3 GHz has been analyzed. The electromagnetic conducted emissions of a commercial IC clock generator have been characterized and modeled from 293 K to 358 K. A temperature parametrized lumped-electrical equivalent model including the PCB and IC behavior has been developed and validated by means of Feature Selective Validation. The results show that the passive distribution networ...
Citació
Berbel, N.; Fernandez-Garcia, R.; Gil, I. Modeling technique of the conducted emission of integrated circuit under different temperatures. "International journal of numerical modeling. Electronic networks devices and fields", 2015.
Paraules clau
EMC, FSV, ICEM-CE, conducted emissions, integrated circuit, internal activity, temperature
Grup de recerca
PERC-UPC - Centre de Recerca d'Electrònica de Potència UPC
RFEMC - Grup de Radiofreqüència i Compatibilitat Electromagnètica en Xarxes de Comunicacions
TIEG - Terrassa Industrial Electronics Group

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