Carregant...
Carregant...

Vés al contingut (premeu Retorn)

An extremely thin and robust interconnecting layer providing 76% fill factor in a tandem polymer solar cell architecture

Autor
Martinez-Otero, A.; Liu, Q.; Mantilla, P.; Montes, M.; Martorell, J.
Tipus d'activitat
Article en revista
Revista
Journal of materials chemistry A
Data de publicació
2015-04-17
Volum
3
Número
20
Pàgina inicial
10681
Pàgina final
10686
DOI
https://doi.org/10.1039/c5ta02205c Obrir en finestra nova
Repositori
http://hdl.handle.net/2117/107352 Obrir en finestra nova
URL
http://pubs.rsc.org/en/Content/ArticleLanding/2015/TA/c5ta02205c#!divAbstract Obrir en finestra nova
Resum
We report a thin and robust interconnecting layer (ICL) for polymer tandem solar cells. This ICL shows low absorption, good electrical contacts, large work function contrast and robustness. Its use yields tandem cells with a very high fill factor of 76%, making this ICL a promising component of future highly efficient multijunction organic solar cells.
Citació
Martinez-Otero, A., Liu, Q., Mantilla, P., Montes, M., Martorell, J. An extremely thin and robust interconnecting layer providing 76% fill factor in a tandem polymer solar cell architecture. "Journal of materials chemistry A", 17 Abril 2015, vol. 3, núm. 20, p. 10681-10686.
Paraules clau
Design, Donors, Enhancement, Interfacial layer, Low-bandgap polymer, Organic electronics, Photovoltaic cells, Power conversion efficiency, Transport
Grup de recerca
DONLL - Dinàmica no Lineal, Òptica no Lineal i Làsers

Participants

  • Martinez Otero, Alberto  (autor)
  • Liu, Quansheng  (autor)
  • Mantilla Perez, Paola  (autor)
  • Montes Bajo, Miguel  (autor)
  • Martorell Pena, Jordi  (autor)

Arxius