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Epoxy composites filled with boron nitride and aluminum nitride for improved thermal conductivity

Autor
Hutchinson, J.M.; Roman, F.; Cortes, M.; Calventus, Y.
Tipus d'activitat
Article en revista
Revista
Polimery
Data de publicació
2017-03-03
Volum
62
Número
7-8
Pàgina inicial
560
Pàgina final
566
DOI
https://doi.org/10.14314/polimery.2017.560 Obrir en finestra nova
Projecte finançador
MAT2014-53706-C3-3-R Nuevos termoestables multifucionales obtenidos mediante curado dual
Repositori
http://hdl.handle.net/2117/113634 Obrir en finestra nova
URL
http://en.www.ichp.pl/Epoxy-composites-filled-with-boron-nitride Obrir en finestra nova
Resum
Epoxy composites containing boron nitride (BN) or aluminum nitride (AlN or Al2N3) particles have been studied with a view to obtaining increased thermal conductivity. The effect of these fillers on the cure reaction has been investigated by differential scanning calorimetry (DSC) for two systems, epoxy-diamine and epoxy-thiol, and for volume fractions up to about 35 % of these filler particles. For the epoxy-diamine system, the glass transition temperature of the fully cured system, the heat of ...
Citació
Hutchinson, J.M., Roman, F., Cortes, M., Calventus, Y. Epoxy composites filled with boron nitride and aluminum nitride for improved thermal conductivity. "Polimery", 3 Març 2017, vol. 62, núm. 7-8, p. 560-566.
Paraules clau
Aluminum nitride, Boron nitride, Differential scanning calorimetry, Epoxy composites, Thermal conductivity
Grup de recerca
POLTEPO - Polímers Termoestables Epoxídics