Carregant...
Carregant...

Vés al contingut (premeu Retorn)

3D metallo-dielectric structures combining electrochemical and electroplating techniques

Autor
Hernandez, D.; Lange, D.; Trifonov, T.; Garin, M.; Garcia, F.; Rodriguez, A.; Alcubilla, R.
Tipus d'activitat
Article en revista
Revista
Microelectronic engineering
Data de publicació
2010-06
Volum
87
Número
5-8
Pàgina inicial
1458
Pàgina final
1462
DOI
https://doi.org/10.1016/j.mee.2009.11.108 Obrir en finestra nova
Repositori
http://hdl.handle.net/2117/7150 Obrir en finestra nova
Resum
Three-dimensional (3D) periodic nickel micro-structures with a periodicity of 4 μm and high number of structural periods were fabricated by electrodeposition. Macroporous silicon, consisting of periodic arrays of sine-wave modulated pores, was used as a deposition template. It was prepared by electrochemical etching of silicon and subsequent pore widening by multiple oxidation/oxide-removal steps. The pore widening allows to open windows between adjacent pores obtaining a 3D network of intercon...
Citació
Hernández, D. [et al.]. 3D metallo-dielectric structures combining electrochemical and electroplating techniques. "Microelectronic engineering", Juny 2010, vol. 87, núm. 5-8, p. 1458-1462.
Grup de recerca
CRnE - Centre de Recerca en Ciència i Enginyeria Multiescala de Barcelona
MNT - Grup de Recerca en Micro i Nanotecnologies

Participants