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Isothermal and non-isothermal cure of a tri-functional epoxy resin (TGAP): a stochastic TMDSC study

Autor
Hutchinson, J.M.; Calventus, Y.; Shiravand, F.; Fraga, I.
Tipus d'activitat
Article en revista
Revista
Thermochimica acta
Data de publicació
2012-02-10
Número
529
Pàgina inicial
14
Pàgina final
21
DOI
https://doi.org/10.1016/j.tca.2011.11.008 Obrir en finestra nova
Repositori
http://hdl.handle.net/2117/14921 Obrir en finestra nova
Resum
The isothermal cure of a highly reactive tri-functional epoxy resin, tri-glycidyl para-amino phenol (TGAP), with diamino diphenyl sulphone (DDS), at two different cure temperatures Tc has been studied by both conventional differential scanning calorimetry (DSC) and by a stochastic temperature modulated DSC technique, TOPEM. From a series of isothermal cure experiments for increasing cure times, the glass transition temperature Tg as a function of isothermal cure time is determined by conventiona...
Citació
Hutchinson, J.M. [et al.]. Isothermal and non-isothermal cure of a tri-functional epoxy resin (TGAP): a stochastic TMDSC study. "Thermochimica acta", 10 Febrer 2012, núm. 529, p. 14-21.
Grup de recerca
POLTEPO - Polímers Termoestables Epoxídics

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