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Testing RF circuits with true non-intrusive built-in sensors

Autor
Abdallah, L.; Stratigopoulos, H.; Mir, S.; Altet, J.
Tipus d'activitat
Presentació treball a congrés
Nom de l'edició
Design, Automation and Test in Europe 2012
Any de l'edició
2012
Data de presentació
2012-03-12
Llibre d'actes
Design, Automation & Test in Europe: Dresden, Germany, March 12-16, 2012: proceedings
Pàgina inicial
1090
Pàgina final
1095
Editor
IEEE
Repositori
http://hdl.handle.net/2117/16309 Obrir en finestra nova
URL
http://cataleg.upc.edu/record=b1252533~S1*cat Obrir en finestra nova
Resum
We present a set of sensors that enable a builtin test in RF circuits. The key characteristic of these sensors is that they are non-intrusive, that is, they are not electrically connected to the RF circuit, and, thereby, they do not degrade its performances. In particular, the presence of spot defects is detected by a temperature sensor, whereas the performances of the RF circuit in the presence of process variations are implicitly predicted by process sensors, namely dummy circuits and process ...
Citació
Abdallah, L. [et al.]. Testing RF circuits with true non-intrusive built-in sensors. A: Design, Automation and Test in Europe. "DATE 2012 - Design, Automation & Test in Europe". Dresden: IEEE, 2012, p. 1090-1095.
Grup de recerca
HIPICS - Grup de Circuits i Sistemes Integrats d'Altes Prestacions

Participants

  • Abdallah, Louay  (autor ponent)
  • Stratigopoulos, Haralampos-G.  (autor ponent)
  • Mir, Salvador  (autor ponent)
  • Altet Sanahujes, Josep  (autor ponent)