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Experimental Investigations into the Effects of Electrical Stress on Electromagnetic Emission from Integrated Circuits

Autor
Boyer, A.; Dhia, S.; Li, B.; Berbel, N.; Fernandez-Garcia, R.
Tipus d'activitat
Article en revista
Revista
IEEE transactions on electromagnetic compatibility
Data de publicació
2014-02-01
Volum
56
Número
1
Pàgina inicial
44
Pàgina final
50
DOI
https://doi.org/10.1109/TEMC.2013.2272195 Obrir en finestra nova
Projecte finançador
CARACTERIZACION Y MODELADO DE LA FIABILIDAD Y ROBUSTEZ DE INTERFERENCIAS ELECTROMAGNTICAS RADIOFRECUENCIA CIRCUITOS INTEGRADOS
Repositori
http://hdl.handle.net/2117/20145 Obrir en finestra nova
URL
http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6563162 Obrir en finestra nova
Resum
Recent studies have shown that the aging of integrated circuits may modify electromagnetic emission significantly. This paper reports on an experiment to elucidate the origins of emis- sion level changes in a test chip using 90-nm CMOS technology. Circuit analysis, combined with electromagnetic emission and on- chip power supply voltage bounce measurements made during the application of electric stress, have identified the role of intrinsic wear-out mechanisms, which contribute to a progressive ...
Citació
Boyer, A. [et al.]. Experimental investigations into the effects of electrical stress on electromagnetic emission from integrated circuits. "IEEE transactions on electromagnetic compatibility", 18 Juliol 2013, p. 1-7.
Paraules clau
Aging effects, EXPERIMENTAL-VERIFICATION, MODEL, electromagnetic emission, integrated circuits, semiconductor device reliability
Grup de recerca
PERC-UPC - Centre de Recerca d'Electrònica de Potència UPC
RFEMC - Grup de Radiofreqüència i Compatibilitat Electromagnètica en Xarxes de Comunicacions
TIEG - Terrassa Industrial Electronics Group

Participants