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Backside polishing detector

Author
Manich, S.; Arumi, D.; Rodriguez-Montanes, R.; Sigl, G.; Mujal, J.
Type of activity
Presentation of work at congresses
Name of edition
1st Workshop on Trustworthy Manufacturing and Utilization of Secure Devices
Date of publication
2013
Presentation's date
2013-12-13
Abstract
Present techniques for attacking secure devices include chip backside reverse engineering. In this presentation a detector sensitive to the removal of silicon backside material is presented. It is based on the side effect of the through silicon bias used for high bandwith communication through silicon die in digital chips.
Keywords
Secure devices, attacks, countermeasures
Group of research
QINE - Low Power Design, Test, Verification and Security ICs

Participants