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Single-Step multiple-layers wafer slicing from macroporous silicon

Autor
Garin, M.; Hernandez, D.; Trifonov, T.; Cardador, D.; Alcubilla, R.
Tipus d'activitat
Presentació treball a congrés
Nom de l'edició
The 28th EU PVSEC, European Photovoltaic Solar Energy Conference and Exhibition
Any de l'edició
2013
Data de presentació
2013-10-01
Llibre d'actes
Proceedings EU PSVSEC 2013, 28th European Photovoltaic Solar Energy Conference and Exhibition, Parc des Expositions Paris Nord Villepinte, Paris, France, Conference 30 Sep - 04 Oct 2013, Exhibition 01 Oct - 03 Oct 2013
Pàgina inicial
933
Pàgina final
936
DOI
10.4229/28thEUPVSEC2013-2CO.2.5
Repositori
http://hdl.handle.net/2117/86600 Obrir en finestra nova
Resum
There is a rising interest, from both photovoltaics and microelectronics industry, in wafer thickness reduction. During the last decade, it has been steadily reduced from 350 µm to 180 µm, but benefits are foreseen for thicknesses well below these values. The current sawing technology, however, suffers from large kerf losses and further reductions are increasingly difficult. Several technologies have emerged aiming to produce thin Si foils from a wafer, such as layer transfer, induced cleaving...
Citació
Garin, M., Hernandez, D., Trifonov, T., Cardador, D., Alcubilla, R. Single-Step multiple-layers wafer slicing from macroporous silicon. A: European Photovoltaic Solar Energy Conference and Exhibition. "Proceedings EU PSVSEC 2013, 28th European Photovoltaic Solar Energy Conference and Exhibition, Parc des Expositions Paris Nord Villepinte, Paris, France, Conference 30 Sep - 04 Oct 2013, Exhibition 01 Oct - 03 Oct 2013". Paris Nord Villepinte: 2013, p. 933-936.
Paraules clau
Crystallisation, Silicon-Films, Thin Film Solar Cell, Wafering
Grup de recerca
CRnE - Centre de Recerca en Ciència i Enginyeria Multiescala de Barcelona
MNT - Grup de Recerca en Micro i Nanotecnologies

Participants

Arxius