Loading...
Loading...

Go to the content (press return)

Single-Step multiple-layers wafer slicing from macroporous silicon

Author
Garin, M.; Hernandez, D.; Trifonov, T.; Cardador, D.; Alcubilla, R.
Type of activity
Presentation of work at congresses
Name of edition
The 28th EU PVSEC, European Photovoltaic Solar Energy Conference and Exhibition
Date of publication
2013
Presentation's date
2013-10-01
Book of congress proceedings
Proceedings EU PSVSEC 2013, 28th European Photovoltaic Solar Energy Conference and Exhibition, Parc des Expositions Paris Nord Villepinte, Paris, France, Conference 30 Sep - 04 Oct 2013, Exhibition 01 Oct - 03 Oct 2013
First page
933
Last page
936
DOI
10.4229/28thEUPVSEC2013-2CO.2.5
Repository
http://hdl.handle.net/2117/86600 Open in new window
Abstract
There is a rising interest, from both photovoltaics and microelectronics industry, in wafer thickness reduction. During the last decade, it has been steadily reduced from 350 µm to 180 µm, but benefits are foreseen for thicknesses well below these values. The current sawing technology, however, suffers from large kerf losses and further reductions are increasingly difficult. Several technologies have emerged aiming to produce thin Si foils from a wafer, such as layer transfer, induced cleaving...
Citation
Garin, M., Hernandez, D., Trifonov, T., Cardador, D., Alcubilla, R. Single-Step multiple-layers wafer slicing from macroporous silicon. A: European Photovoltaic Solar Energy Conference and Exhibition. "Proceedings EU PSVSEC 2013, 28th European Photovoltaic Solar Energy Conference and Exhibition, Parc des Expositions Paris Nord Villepinte, Paris, France, Conference 30 Sep - 04 Oct 2013, Exhibition 01 Oct - 03 Oct 2013". Paris Nord Villepinte: 2013, p. 933-936.
Keywords
Crystallisation, Silicon-Films, Thin Film Solar Cell, Wafering
Group of research
CRnE - Barcelona Research Center in Multiscale Science and Engineering
MNT - Micro and Nanotechnologies Research Group

Participants

Attachments