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Characterization of conducted emission at high frequency under different temperature

Author
Berbel, N.; Fernandez-Garcia, R.; Gil, I.
Type of activity
Presentation of work at congresses
Name of edition
EMC COMPO 2013
Date of publication
2013
Presentation's date
2013-12-17
Book of congress proceedings
Proceedings of EMC COMPO 2013
DOI
https://doi.org/10.1109/EMCCompo.2013.6735190 Open in new window
Repository
http://hdl.handle.net/2117/21690 Open in new window
Abstract
Download Citation Email Print Request Permissions Save to Project In this paper, the characterization of the EMC conducted emissions of integrated circuits under different temperature stress condition, up to 3 GHz is presented. The impact of high temperature has been measured on the input impedance of propagation paths of the electromagnetic conducted emissions, as well as on the electromagnetic noise of a clock generator. In this paper, the characterization of the EMC conducted...
Citation
Berbel, N.; Fernandez, R.; Gil, I. Characterization of conducted emission at high frequency under different temperature. A: International Workshop on Electromagnetic Compatibility of Integrated Circuits. "Proceedings of EMC COMPO 2013". Nara: 2013.
Keywords
EMC, Integrated circuit, conducted emission, switching noise, temperature impact
Group of research
Electromagnetic Compatibility (EMC); Widebandgap (WBG); Internal Activity; Feature Selective Validation (FSV); Spread Spectrum modulation; Reliability; Multilevel Converters; Fault detection;
PERC-UPC - Power Electronics Research Centre
RFEMC -

Participants