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Characterization of conducted emission at high frequency under different temperature

Autor
Berbel, N.; Fernandez-Garcia, R.; Gil, I.
Tipus d'activitat
Presentació treball a congrés
Nom de l'edició
EMC COMPO 2013
Any de l'edició
2013
Data de presentació
2013-12-17
Llibre d'actes
Proceedings of EMC COMPO 2013
DOI
https://doi.org/10.1109/EMCCompo.2013.6735190 Obrir en finestra nova
Repositori
http://hdl.handle.net/2117/21690 Obrir en finestra nova
Resum
Download Citation Email Print Request Permissions Save to Project In this paper, the characterization of the EMC conducted emissions of integrated circuits under different temperature stress condition, up to 3 GHz is presented. The impact of high temperature has been measured on the input impedance of propagation paths of the electromagnetic conducted emissions, as well as on the electromagnetic noise of a clock generator. In this paper, the characterization of the EMC conducted...
Citació
Berbel, N.; Fernandez, R.; Gil, I. Characterization of conducted emission at high frequency under different temperature. A: International Workshop on Electromagnetic Compatibility of Integrated Circuits. "Proceedings of EMC COMPO 2013". Nara: 2013.
Paraules clau
EMC, Integrated circuit, conducted emission, switching noise, temperature impact
Grup de recerca
PERC-UPC - Centre de Recerca d'Electrònica de Potència UPC
RFEMC - Grup de Radiofreqüència i Compatibilitat Electromagnètica en Xarxes de Comunicacions
TIEG - Terrassa Industrial Electronics Group

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