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Modeling technique of the conducted emission of integrated circuit under different temperatures

Author
Berbel, N.; Fernandez-Garcia, R.; Gil, I.
Type of activity
Journal article
Journal
International journal of numerical modeling. Electronic networks devices and fields
Date of publication
2016-03-01
Volume
29
First page
291
Last page
300
DOI
https://doi.org/10.1002/jnm.2076 Open in new window
Project funding
New electronic design strategies for deployment of wireless sensor netwotks in smart textile
Repository
http://hdl.handle.net/2117/28179 Open in new window
URL
http://onlinelibrary.wiley.com/doi/10.1002/jnm.2076/abstract Open in new window
Abstract
Copyright © 2015 John Wiley & Sons, Ltd. In this paper the temperature impact on conducted emissions of ICs up to 3 GHz has been analyzed. The electromagnetic conducted emissions of a commercial IC clock generator have been characterized and modeled from 293 K to 358 K. A temperature parametrized lumped-electrical equivalent model including the PCB and IC behavior has been developed and validated by means of Feature Selective Validation. The results show that the passive distribution networ...
Citation
Berbel, N.; Fernandez-Garcia, R.; Gil, I. Modeling technique of the conducted emission of integrated circuit under different temperatures. "International journal of numerical modeling. Electronic networks devices and fields", 2015.
Keywords
EMC, FSV, ICEM-CE, conducted emissions, integrated circuit, internal activity, temperature
Group of research
Electromagnetic Compatibility (EMC); Widebandgap (WBG); Internal Activity; Feature Selective Validation (FSV); Spread Spectrum modulation; Reliability; Multilevel Converters; Fault detection;
PERC-UPC - Power Electronics Research Centre
RFEMC -

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