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Backside polishing detector: a new protection against backside attacks

Author
Manich, S.; Arumi, D.; Rodriguez-Montanes, R.; Mujal, J.; Hernandez, D.
Type of activity
Presentation of work at congresses
Name of edition
XXX Conference on Design of Circuits and Integrated Systems
Date of publication
2015
Presentation's date
2015-11-25
Book of congress proceedings
DCIS'15 - XXX Conference on Design of Circuits and Integrated Systems
First page
1
Last page
6
Repository
http://hdl.handle.net/2117/84577 Open in new window
URL
http://146.193.44.212/wordpress/wp-content/uploads/2015/11/DCIS2015_program_tech.pdf Open in new window
Abstract
Secure chips are in permanent risk of attacks. Physical attacks usually start removing part of the package and accessing the dice by different means: laser shots, electrical or electromagnetic probes, etc. Doing this from the backside of the chip gives some advantages since no metal layers interfere between the hacker and the signals of interest. The bulk silicon is thinned from hundreds to some tens of micrometers in order to improve the performance of the attack. In this paper a backside polis...
Citation
Manich, S., Arumi, D., Rodriguez, R., Mujal, J., Hernandez, D. Backside polishing detector: a new protection against backside attacks. A: Conference on Design of Circuits and Integrated Systems. "DCIS'15 - XXX Conference on Design of Circuits and Integrated Systems". Estoril: 2015, p.1-6
Keywords
Attack Detector, Built-in Self Surveillance, Phase Detector, Security, TSV
Group of research
QINE - Low Power Design, Test, Verification and Security ICs

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