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Innovative cooling system for embedded power electronics

Type of activity
Competitive project
Acronym
ICOPE
Funding entity
Commission of European Communities
Funding entity code
H2020-755556-ICOPE
Amount
209.300,00 €
Start date
2017-06-01
End date
2019-09-30
URL
http://cordis.europa.eu/projects/755556 Open in new window
Abstract
The main goal of this project is the design of innovative and efficient air cooled heat sinks to cool the power electronics modules that are a key component of the more electrical aircraft power management centre design. The new design is expected to be developed in two stages. The first one should be covered by the implementation of Annealed Pyrolytic Graphite (APG) and folded brazed fins, while in the second the integration of Metal Matrix Composites (MMC) is expected. The final target of the development is the reduction of weight of the whole power management system (bay integrating four heat sinks), while maintaining an efficient and reliable cooling.
Coming from advances in the power semiconductors field, by the use of high-temperature and more efficient materials such as Silicon Carbide (SiC) and Gallium Nitride (GAN), the thermal management strategy could take into consideration the implementation of air cooled solutions, which are expected to reduce the overall weight comparing to liquid or two-phase flow solutions, while also adding some benefits in terms of reliability and maintenance aspects.
Scope
Europa
Plan
HORIZON 2020 (2014-2020)
Call year
2017
Funcding program
Pilar Reptes Socials
Funding call
Clean Sky2
Grant institution
European Commission

Participants