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Curing of off-stoichiometric amine-epoxy thermosets

Author
Morancho, J.; Ramis, X.; Fernandez-Francos, X.; Salla, J.; Konuray, A.; Serra, M. À.
Type of activity
Presentation of work at congresses
Name of edition
1st Journal of Thermal Analysis and Calorimetry Conference and 6th V4 (Joint Czech-Hungarian-Polish-Slovakian) Thermoanalytical Conference
Date of publication
2017
Presentation's date
2017-06-07
Book of congress proceedings
JTACC+V4: 1st Journal of Thermal Analysis and Calorimetry Conference and 6th V4 (Joint Czech-Hungarian-Polish-Slovakian) Thermoanalytical Conference, June 6-9, 2017, Budapest, Hungary: book of abstracts
First page
242
Last page
243
Abstract
Epoxy resins are widely used in applications such as adhesives, coatings, electric laminates, encapsulation of semiconductors devices, matrix material for composites, structural components and cryogenic engineering because of their superior mechanical properties, adhesion and chemical resistance. Curing of an epoxy/amine mixture proceeds through different reaction mechanisms. In competition with the main step-wise polycondensation reaction between epoxy and amine groups, homopolymerization of ep...
Keywords
Epoxy networks, isothermal cure, kinetics, thermal cure
Group of research
POLTEPO - Thermosetting Epoxy Polymers

Participants