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Millimeter-Wave Propagation within a Computer Chip Package

Author
Timoneda, X.; Abadal, S.; Albert Cabellos-Aparicio; Manessis, D.; Zhou, J.; Franques, A.; Torrellas, J.; Alarcon, E.
Type of activity
Presentation of work at congresses
Name of edition
2018 IEEE International Symposium on Circuits and Systems
Date of publication
2018
Presentation's date
2018-05
Book of congress proceedings
2018 IEEE International Symposium on Circuits and Systems (ISCAS): proceedings: 27-30 May 2018: Florence, Italy
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
DOI
https://doi.org/10.1109/ISCAS.2018.8351875 Open in new window
Project funding
Towards ubiquitous graphene based RF communications demonstrating and understanding graphene based plasmonic THz antenna potential and limitations
VisorSurf - A Hardware Platform for Software-driven Functional Metasurfaces
Repository
http://hdl.handle.net/2117/118233 Open in new window
URL
https://ieeexplore.ieee.org/document/8351875/ Open in new window
Abstract
Wireless Network-on-Chip (WNoC) appears as a promising alternative to conventional interconnect fabrics for chip-scale communications. The WNoC paradigm has been extensively analyzed from the physical, network and architecture perspectives assuming mmWave band operation. However, there has not been a comprehensive study at this band for realistic chip packages and, thus, the characteristics of such wireless channel remain not fully understood. This work addresses this issue by accurately modelin...
Citation
Timoneda, X., Abadal, S., Albert Cabellos-Aparicio, Manessis, D., Zhou, J., Franques, A., Torrellas, J., Alarcon, E. Millimeter-wave propagation within a computer chip package. A: IEEE International Symposium on Circuits and Systems. "2018 IEEE International Symposium on Circuits and Systems (ISCAS): proceedings: 27-30 May 2018: Florence, Italy". Institute of Electrical and Electronics Engineers (IEEE), 2018, p. 1-5.
Keywords
Chip packages, Computer chips, Electronics packaging, Flip-chip packages, Integrated environment, Interconnect fabrics, Millimeter waves, Mm-wave band, Network-on-chip, Parametric study, Space division multiple access, Wave propagation, Wireless channel, Wireless interconnects
Group of research
CBA - Communications and Broadband Architectures Lab
EPIC - Energy Processing and Integrated Circuits
PERC-UPC - Power Electronics Research Centre

Participants

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