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New epoxy composite thermosets with enhanced thermal conductivity and high Tg obtained by cationic homopolymerization

Author
Isarn, I.; Gamardella, F.; Massagués, L.; Fernandez-Francos, X.
Type of activity
Journal article
Journal
Polymer composites
Date of publication
2018-06-01
Volume
39
Number
S3
First page
E1760
Last page
E1769
DOI
10.1002/pc.24774
Repository
http://hdl.handle.net/2117/130381 Open in new window
URL
https://onlinelibrary.wiley.com/doi/epdf/10.1002/pc.24774 Open in new window
Abstract
Thermal dissipation is a critical aspect for the performance and lifetime of electronic devices. In this work, novel composites based on a cycloaliphatic epoxy matrix and BN fillers, obtained by cationic curing of mixtures of 3,4-epoxy cyclohexylmethyl 3,4-epoxy cyclohexane carboxylate (ECC) with several amounts of hexagonal boron nitride (BN) were prepared and characterized. As cationic initiator a commercial benzylanilinium salt was used, which by addition of triethanolamine, exhibited an exce...
Citation
Isarn, I. [et al.]. New epoxy composite thermosets with enhanced thermal conductivity and high Tg obtained by cationic homopolymerization. "Polymer composites", 1 Juny 2018, vol. 39, núm. S3, p. E1760-E1769.
Group of research
POLTEPO - Thermosetting Epoxy Polymers

Participants

  • Isarn Garcia, Isaac  (author)
  • Gamardella, Francesco  (author)
  • Massagués, Lluís  (author)
  • Fernandez Francos, Xavier  (author)

Attachments