Loading...
Loading...

Go to the content (press return)

Achieving high thermal conductivity in epoxy composites: Effect of boron nitride particle size and matrix-filler interface

Author
Moradi, S.; Calventus, Y.; Roman, F.; Hutchinson, J.M.
Type of activity
Journal article
Journal
Polymers
Date of publication
2019-07-06
Volume
11
Number
7
First page
1156-1
Last page
1156-17
DOI
10.3390/polym11071156
Repository
http://hdl.handle.net/2117/166553 Open in new window
URL
https://www.mdpi.com/2073-4360/11/7/1156 Open in new window
Abstract
For the thermal management of high watt density circuit layers, it is common to use a filled epoxy system to provide an electrically insulating but thermally conducting bond to a metal substrate. An epoxy-thiol system filled with boron nitride (BN), in the form of 2, 30 and 180 µm platelets, has been investigated with a view to achieving enhanced thermal conductivity. The effect of BN content on the cure reaction kinetics has been studied by differential scanning calorimetry and the thermal con...
Citation
Moradi, S. [et al.]. Achieving high thermal conductivity in epoxy composites: Effect of boron nitride particle size and matrix-filler interface. "Polymers", 6 Juliol 2019, vol. 11, núm. 7, p. 1156-1-1156-17.
Keywords
Boron nitride, Differential scanning calorimetry (DSC), Epoxy, Thermal conductivity, Thiol
Group of research
POLTEPO - Thermosetting Epoxy Polymers

Participants

Attachments