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Dual curing of an epoxy resin with dicarboxylic acids

Author
Morancho, J.; Ramis, X.; Fernandez-Francos, X.; Konuray, O.; Salla, J.; Serra, M. À.
Type of activity
Journal article
Journal
Journal of thermal analysis and calorimetry
Date of publication
2020-03-18
Volume
142
Number
2
First page
607
Last page
615
DOI
10.1007/s10973-020-09523-z
Repository
http://hdl.handle.net/2117/329922 Open in new window
URL
https://link.springer.com/article/10.1007%2Fs10973-020-09523-z Open in new window
Abstract
In this work, we have studied the preparation and characterization of a new family of thermosets based on off-stoichiometric diacid-epoxy formulations in the presence of 1-methylimidazole as initiator. Tri-glycidyl para-amino phenol has been used as epoxy resin and isophthalic (AIFT), and terephthalic (ATFT) acids have been used as diacids. The curing has been analyzed isothermally at different temperatures by calorimetry, using an isoconversional method and the Šestak–Berggren equation to de...
Citation
Morancho, J. [et al.]. Dual curing of an epoxy resin with dicarboxylic acids. "Journal of thermal analysis and calorimetry", 18 Març 2020,
Keywords
Diacids, Dual curing, Epoxy networks, Isothermal cure, Kinetics
Group of research
POLTEPO - Thermosetting Epoxy Polymers

Participants