The influence of the shape of VLSI interconnects on the lifetime due to electromigration is investigated. Simulations and experiments indicate that, in some cases, the right angle corners of the metal lines, widely interconnections layout of VLSI circuits, reduce the lifetime of such interconnects. Substitutions by more gradual, smaller angled corners improve electromigration lifetimes.
Gonzalez, J.; Rubio, A. Shape effects on electromigration in VLSI interconnects. "Microelectronics reliability", Juliol 1997, vol. 37, núm. 7, p. 1073-1078.