
Perez, D.; Gil, I.; Gago, J.; Fernandez-Garcia, R.; Balcells, J.; Gonzalez, D.; Berbel, N.; Mon, J.
IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
Vol. 2, num. 2, p. 240-247
DOI: 10.1109/TCPMT.2011.2172442
Date of publication: 2012-02-10
Journal article