FUTUR. Website for the scientific production of UPC researchers

People  (2 results)

• Arumi Delgado, Daniel

  Total activity: 67
  Department of Electronic Engineering
  QINE - Low Power Design, Test, Verification and Security ICs
  Barcelona School of Industrial Engineering (ETSEIB)
  The School of Industrial, Aerospace and Audiovisual Engineering of Terrassa (ESEIAAT)

• Rodríguez Montañés, Rosa

  Total activity: 140
  Department of Electronic Engineering
  QINE - Low Power Design, Test, Verification and Security ICs
  Barcelona School of Telecommunications Engineering (ETSETB)
  Barcelona School of Industrial Engineering (ETSEIB)

Organization

Scientific and technological production  (18 results)

• Postbond test of through-silicon vias with resistive open defects  

   Rodriguez-Montanes, R.; Arumi, D.; Figueras, J.
  IEEE transactions on very large scale integration (VLSI) systems
  Vol. 27, num. 11, p. 2596-2607
  DOI: 10.1109/TVLSI.2019.2925971
  Date of publication: 2019-07-17
  Journal article

• DC temperature measurements to characterize the central frequency and 3 dB bandwidth in mmW power amplifiers  

   Aragones, X.; Mateo, D.; Gonzalez, J.; Vidal, E.; Gómez, D.; Martineau, B.; Altet, J.
  IEEE microwave and wireless components letters
  Vol. 25, num. 11, p. 745-747
  DOI: 10.1109/LMWC.2015.2479848
  Date of publication: 2015-11
  Journal article

• Prebond testing of weak defects in TSVs

   Arumi, D.; Rodriguez-Montanes, R.; Figueras, J.
  IEEE transactions on very large scale integration (VLSI) systems
  Vol. PP, num. 99, p. 31-36
  DOI: 10.1109/TVLSI.2015.2448594
  Date of publication: 2015-08-07
  Journal article

• Post-Bond test of through-silicon vias with open defects

   Rodriguez-Montanes, R.; Arumi, D.; Figueras, J.
  IEEE European Test Symposium
  p. 1-6
  DOI: 10.1109/ETS.2014.6847816
  Presentation's date: 2014-05-29
  Presentation of work at congresses

• Temperature sensors to measure the central frequency and 3 dB bandwidth in mm W power amplifiers

   Altet, J.; Mateo, D.; Gómez, D.; Gonzalez, J.; Martineau, B.; Siligaris, A.; Aragones, X.
  IEEE microwave and wireless components letters
  Vol. 24, num. 4, p. 272-274
  DOI: 10.1109/LMWC.2013.2293668
  Date of publication: 2014-04
  Journal article

Journals