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• Postbond test of through-silicon vias with resistive open defects  

   Rodriguez-Montanes, R.; Arumi, D.; Figueras, J.
  IEEE transactions on very large scale integration (VLSI) systems
  Vol. 27, num. 11, p. 2596-2607
  DOI: 10.1109/TVLSI.2019.2925971
  Date of publication: 2019-07-17
  Journal article

• Post-Bond test of through-silicon vias with open defects

   Rodriguez-Montanes, R.; Arumi, D.; Figueras, J.
  IEEE European Test Symposium
  p. 1-6
  DOI: 10.1109/ETS.2014.6847816
  Presentation's date: 2014-05-29
  Presentation of work at congresses

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